SRX32-018-P7

As a professional heat sink manufacturer with 20 years of expertise in the thermal management industry, our SRX32-018-P7 is a Powder-Coated Extruded Heat Sink integrating ultra-thin structure and high-efficiency heat dissipation. It is also a Thin-Profile Extruded Heat Sink optimized for compact scenarios, precisely meeting the thermal management needs of electronic devices in small spaces.
This product is made of high thermal conductivity 6063 aluminum alloy and formed in one piece through precision extrusion technology. The fin spacing and height are optimized through fluid dynamics simulation, maximizing the heat dissipation area even with an ultra-thin thickness of only 18mm . As a typical Thin-Profile Extruded Heat Sink, its flat structure can be easily embedded in limited spaces such as PCB gaps and LED strip card slots, without occupying additional vertical installation height, making it especially suitable for size-sensitive devices like routers and optical modems.

The Powder-Coated Extruded Heat Sink features an electrostatic powder coating on the surface, which not only offers excellent corrosion resistance and scratch resistance but also provides electrical insulation protection, avoiding short-circuit risks between the metal heat sink and components, thus adapting to high-reliability application scenarios. The coating adhesion has been verified by cross-cut tests, capable of withstanding long-term high-low temperature cycles and vibration impacts, ensuring stable performance even under harsh working conditions.

In terms of heat dissipation efficiency, the comb-shaped fin design of the SRX32-018-P7 accelerates air convection. Combined with the high thermal conductivity of aluminum alloy, it can quickly conduct and dissipate heat generated by components such as chips and power tubes, effectively reducing the core temperature by 15%-25% and preventing device performance degradation or damage due to overheating. The product is equipped with standardized mounting holes, supporting two installation methods: screw fixation and thermal adhesive attachment, which is compatible with the installation needs of mainstream small electronic components on the market.

We have a complete production quality control system, independently completing the entire process from aluminum ingot melting, extrusion molding to powder coating. Each heat sink undergoes pressure resistance test and thermal resistance inspection, complying with RoHS and REACH environmental standards. We support customizing fin density, hole layout and coating color according to customer needs, providing you with a one-stop thermal management solution for your devices from design to mass production.