SRX29-023-D1

As a manufacturer with 20 years of experience in R&D and production of profile heat sinks, our SRX29-023-D1 is a high-performance Continuous Extruded Heat Sink designed for high-power compact electronic devices. It is also a Dense-Fin Extruded Heat Sink that combines excellent heat dissipation efficiency and space adaptability.
We adopt mature continuous extrusion molding technology, using high-quality 6063-T5 aluminum alloy as the base material. The complete fin structure is formed in one piece through custom molds, with no splicing or welding throughout the process. This ensures uniform and smooth heat conduction inside the heat sink, avoiding thermal resistance loss caused by traditional splicing processes. This technology not only guarantees consistent product performance but also supports large-scale mass production to meet the stable delivery requirements of projects.

The core advantage of SRX29-023-D1 lies in its dense-fin design: the dense fins (Dense-Fin) with a pitch of 1mm increase the heat dissipation surface area by more than 35% compared with conventional heat sinks. Combined with the excellent thermal conductivity of aluminum alloy, it can quickly conduct heat from the chip to the fins and dissipate it into the air, with a thermal resistance as low as 0.8℃/W. It can stably support the heat dissipation needs of 10-30W power chips, especially suitable for small-space and high-heat scenarios such as optical modems, routers, and industrial control modules.

The base of the product is equipped with a high-viscosity thermal pad, which can be directly attached to the chip surface without additional application of thermal grease. The integrated mounting pins on both sides, combined with precisely positioned threaded holes, enable secure fixation without tools, greatly simplifying the installation process. The surface is treated with natural anodization, which not only improves corrosion resistance and insulation but also supports custom powder coating (Powder-Coated) in black, silver, etc., according to customer needs, balancing functionality and appearance.

We have an independent mold development center, which can adjust fin density, hole layout and surface treatment solutions according to customer needs, and provide free sample testing. With ISO9001 quality system certification and full-process inspection and control, SRX29-023-D1 has become a trusted choice for global electronic device manufacturers. Whether it is mass delivery of foreign trade orders or customized needs of domestic projects, we can provide efficient and stable heat dissipation solutions.