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Housing
SFP-W009
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The SFP-W009 optical module housing is a precision structural component designed specifically for medium-to-high speed optical communication scenarios. Guided by the core design concept of "high stability + strong adaptability", it provides reliable protection and performance support for SFP+ and SFP28 modules with 10G/25G data rates.
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In terms of material, high-quality aluminum alloy is selected. This material combines excellent mechanical strength and thermal conductivity—it not only meets the structural load-bearing requirements of modules during long-term operation (tensile strength ≥ 290MPa) but also quickly conducts heat from internal chips to avoid performance degradation caused by high temperatures. The thermal conductivity of the housing reaches 155W/(m·K), which is 18% higher than that of ordinary aluminum alloy.
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In terms of craftsmanship, 5-axis CNC precision machining is adopted, controlling the tolerance of key dimensions within ±0.02mm. This ensures precise fit with internal components of optical modules such as optical engines and connectors, preventing signal interference caused by assembly gaps. The surface undergoes hard anodization treatment, with an oxide film thickness of 12-15μm. It not only features scratch resistance and fingerprint resistance but also resists moisture and mild corrosion in industrial environments, withstanding 48 hours of salt spray testing without rusting.
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In terms of performance design, the housing is built with an integrated heat dissipation rib structure, which works with the hollowed-out diversion grooves on the side to accelerate air convection and reduce the module's operating temperature by 3-5℃. Meanwhile, through optimized electromagnetic shielding design at the housing's joint, the measured electromagnetic radiation suppression effect complies with the EN 55032 Class B standard, effectively reducing the impact of external electromagnetic interference on optical signal transmission.
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In terms of adaptability, it strictly adheres to the IEC 60837 standard, being compatible with mainstream SFP package sizes. It can be directly matched with modules such as 10G Ethernet and 25G Fibre Channel without adjusting the assembly production line. Additionally, it supports customized interface opening positions, housing colors (default black, optional silver/gray), and laser-engraved logos for customers.
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In the quality control process, each batch of products undergoes high-low temperature cycling (-40℃~85℃, 100 cycles), vibration impact (10-2000Hz, 10g acceleration), and airtightness testing (pressure difference ≤ 5kPa/24h). It meets the telecom-grade GR-63-CORE and industrial-grade IEC 60068 standards, making it suitable for scenarios such as optical links for data center servers, 5G base station fronthaul equipment, and industrial control optical communication systems. It builds a solid "protective barrier" for the long-term stable operation of optical modules.